The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2023
Filed:
May. 17, 2018
Kyoritsu Chemical & Co., Ltd., Tokyo, JP;
Hamamatsu Photonics K.k., Hamamatsu, JP;
Mikiharu Kuchiki, Tokyo, JP;
Hidefumi Kinda, Tokyo, JP;
Daisuke Kurita, Tokyo, JP;
Takeshi Sakamoto, Hamamatsu, JP;
Takafumi Ogiwara, Hamamatsu, JP;
Yuta Kondoh, Hamamatsu, JP;
Naoki Uchiyama, Hamamatsu, JP;
Kyoritsu Chemical & Co., Ltd., Tokyo, JP;
HAMAMATSU PHOTONICS K.K., Hamamatsu, JP;
Abstract
A object cutting method includes a first step of attaching an expandable sheet to a front surface or a back surface of a object, a second step of irradiating the object with a laser light along a line to cut to form a modified region, and expanding the expandable sheet to divide at least a part of the object into a plurality of chips and to form a gap that exists between the chips and extends to a side surface crossing the front surface and the back surface of the object, a third step of, after the second step, filling the gap with a resin from an outer edge portion including the side surface of the object, a fourth step of, after the third step, curing and shrinking the resin, and a fifth step of, after the fourth step, taking out the chips from the expandable sheet.