The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2023
Filed:
Jul. 11, 2022
Applicant:
Destiny Copper Inc., St. Catharines, CA;
Inventors:
Ian David Brindle, St. Catharines, CA;
Molina Audrey Lorraine Sheepwash, Welland, CA;
Assignee:
Destiny Copper Inc., St. Catharines, CA;
Primary Examiner:
Int. Cl.
CPC ...
B22F 9/20 (2006.01); C22B 3/08 (2006.01); C22B 5/00 (2006.01); C22B 15/00 (2006.01);
U.S. Cl.
CPC ...
B22F 9/20 (2013.01); C22B 3/08 (2013.01); C22B 5/00 (2013.01); C22B 15/0071 (2013.01); C22B 15/0089 (2013.01); B22F 2301/10 (2013.01);
Abstract
Processes for producing copper granules on a surface of a reducing metal. The process can include contacting the reducing metal with an aqueous solution comprising a copper(II) salt and a halide. The molar ratio of the halide to the copper(II) in the copper (II) salt can be at least about 3:1. The granular copper can be produced on a surface of the reducing metal, and is optionally removed from the surface of the reducing metal by shaking, washing, and/or brushing, and/or optionally with stirring and/or circulating of the aqueous solution.