The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2023
Filed:
Jun. 06, 2022
Sodick Co., Ltd., Kanagawa, JP;
Ichiro Araie, Kanagawa, JP;
Toshio Kaji, Kanagawa, JP;
Tatsuro Hayakawa, Kanagawa, JP;
Hiroshi Amioka, Kanagawa, JP;
Atsushi Hirota, Kanagawa, JP;
Sodick Co., Ltd., Kanagawa, JP;
Abstract
A stress controlled layer is constituted to include a compressive stress applied part that is a region to which a compressive stress is applied and a compressive stress non-applied part that is a region different from the compressive stress applied part. In a solidifying step, scanning of a laser beam or an electron beam is performed while a scanning direction for the compressive stress applied part is different from a scanning direction for the compressive stress non-applied part such that the compressive stress applied part expands further than the compressive stress non-applied part or the compressive stress non-applied part shrinks compared with the compressive stress applied part based on a relationship between the scanning direction and an expansion quantity or a shrinkage quantity at a time of temperature change or at a time of heat treatment.