The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2023
Filed:
Sep. 30, 2020
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Masayoshi Yamada, Nagano, JP;
Hikaru Iwai, Nagano, JP;
Mitsuru Miyasaka, Nagano, JP;
Yoshio Arai, Nagano, JP;
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B06B 1/06 (2006.01); B06B 1/02 (2006.01); H10N 30/02 (2023.01); H10N 30/06 (2023.01); H10N 30/88 (2023.01); H10N 30/80 (2023.01); H10N 30/87 (2023.01);
U.S. Cl.
CPC ...
B06B 1/0644 (2013.01); B06B 1/0215 (2013.01); H10N 30/02 (2023.02); H10N 30/06 (2023.02); H10N 30/802 (2023.02); H10N 30/875 (2023.02); H10N 30/88 (2023.02);
Abstract
An ultrasonic device includes an ultrasonic sensor, a wiring member, and a housing, in which the wiring member has a covered wire that covers a signal line coupled to the ultrasonic sensor via an insulating layer, and a conductive member that is electrically coupled with the covered wire, the housing has a plurality of housing components having conductivity, and covers the ultrasonic sensor with the plurality of housing components, and the conductive member is electrically coupled to and held by the plurality of housing components.