The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2023

Filed:

Mar. 18, 2021
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Youngmin Cho, Seongnam-si, KR;

Hongam Kim, Seoul, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Yongin-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10K 59/131 (2023.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H10K 59/131 (2023.02); H01L 24/06 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06132 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16502 (2013.01); H01L 2224/29198 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73204 (2013.01);
Abstract

The present application relates to an electronic device. The electronic device includes a first electronic component and a second electronic component. The first electronic component includes a first pad area including first pads and second pads spaced apart from the first pads. A number of the first pads is greater than a number of the second pads. The second electronic component includes first bumps electrically connected to the first pads, and second bumps electrically connected to the second pads. Each of the second bumps has a bonding area greater than a bonding area of each of the first bumps. A conductive adhesive layer is disposed between the first electronic component and the second electronic component to electrically connect the first pads to the first bumps.


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