The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2023
Filed:
Mar. 12, 2020
Applicant:
Carnegie Mellon University, Pittsburgh, PA (US);
Inventors:
O Burak Ozdoganlar, Sewickley, PA (US);
Carmel Majidi, Pittsburgh, PA (US);
Kadri Bugra Ozutemiz, Pittsburgh, PA (US);
James Wissman, Hyattsville, MD (US);
Assignee:
CARNEGIE MELLON UNIVERSITY, Pittsburgh, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/12 (2006.01); H05K 1/02 (2006.01); H01L 23/498 (2006.01); H01Q 1/36 (2006.01); H05K 3/38 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0283 (2013.01); H01L 21/4846 (2013.01); H01L 23/4985 (2013.01); H01Q 1/364 (2013.01); H05K 3/1208 (2013.01); H05K 3/1216 (2013.01); H05K 3/1241 (2013.01); H05K 3/1258 (2013.01); H05K 3/388 (2013.01);
Abstract
A high-throughput method of manufacturing a liquid metal circuit may include applying a liquid metal to an alloying metal pattern on an elastic substrate to form the liquid metal circuit. The elastic substrate may have a surface area greater than 1 square inch. The liquid metal circuit may include a plurality of liquid metal circuits on the elastic substrate. Methods of using the liquid metal circuit are also described.