The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2023

Filed:

Apr. 26, 2021
Applicants:

Chuzhou Hkc Optoelectronics Technology Co., Ltd, Anhui, CN;

Hkc Corporation Limited, Guangdong, CN;

Inventors:

Shishuai Huang, Chuzhou, CN;

Wei Li, Shenzhen, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); H01L 27/127 (2013.01);
Abstract

An array substrate, a manufacturing method thereof, and a display device are provided. The array substrate includes a display area and a non-display area in which a peripheral circuit is provided. The peripheral circuit includes a test area, a bonding area, and a cutting area. The test area is provided with a test signal line for providing a test signal. The bonding area is adjacent to the display area, and the bonding area and the test area are electrically connected through signal leads. The cutting area is disposed between the test area and the bonding area. After a cutting process is completed in the cutting area, a cutting opening is formed on each signal lead. A position of the cutting opening of at least one signal lead is different from positions of the cutting openings of other signal leads in height along an extending direction of the signal leads.


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