The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2023

Filed:

Jan. 21, 2020
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Tatsushi Kaneda, Osaka, JP;

Hirotaka Oomori, Osaka, JP;

Ren Kimura, Osaka, JP;

Toru Hiyoshi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A semiconductor includes: a substrate; a circuit pattern on the substrate, and including a first region, a second region located away from the first region, and a third region between the first region and the second region; a first chip disposed in the second region and including a diode; a second chip disposed in the third region, the second chip including a vertical transistor having a source pad disposed on a surface opposite to a surface facing the third region in a thickness direction of the substrate, and a gate pad disposed at a position different from the source pad; a first wire including a first bonded portion bonded to the first region, a second bonded portion bonded to the second chip, and a third bonded portion bonded to the first chip; and a second wire arranged to be adjacent to the first wire with the gate pad sandwiched therebetween.


Find Patent Forward Citations

Loading…