The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2023
Filed:
Sep. 07, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16147 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29313 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29409 (2013.01); H01L 2224/29411 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/29444 (2013.01); H01L 2224/29447 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/32147 (2013.01); H01L 2224/32237 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/9211 (2013.01); H01L 2924/0545 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1443 (2013.01); H01L 2924/20104 (2013.01); H01L 2924/20752 (2013.01); H01L 2924/20753 (2013.01); H01L 2924/20754 (2013.01);
Abstract
A hybrid bonding structure and a semiconductor including the hybrid bonding structure are provided. The hybrid bonding structure includes a solder ball and a solder paste bonded to the solder ball. The solder paste may include solder particles including at least one of In, Zn, SnBiAg alloy, or SnBi alloy, and ceramic particles. The solder paste may include a flux. The solder particles may include Sn(42.0 wt %)-Ag(0.4 wt %)-Bi(57.5−X) wt %, and the ceramic particles include CeO(X) wt %, where 0.05≤X≤0.1.