The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2023

Filed:

Feb. 21, 2022
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Jiro Yota, Westlake Village, CA (US);

Dogan Gunes, North Andover, MA (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 23/10 (2013.01); H01L 23/3192 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/29 (2013.01); H01L 23/3114 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/94 (2013.01); H01L 2224/0215 (2013.01); H01L 2224/02125 (2013.01); H01L 2224/0391 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05005 (2013.01); H01L 2224/0508 (2013.01); H01L 2224/0509 (2013.01); H01L 2224/05011 (2013.01); H01L 2224/05012 (2013.01); H01L 2224/05018 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05078 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05084 (2013.01); H01L 2224/05088 (2013.01); H01L 2224/05093 (2013.01); H01L 2224/05096 (2013.01); H01L 2224/05098 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/11 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/29022 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/94 (2013.01); H01L 2924/12 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/163 (2013.01); H01L 2924/35121 (2013.01);
Abstract

Structures, methods and devices are disclosed, related to improved stack structures in electronic devices. In some embodiments, a stack structure includes a pad implemented on a substrate, the pad including a polymer layer having a side that forms an interface with another layer of the pad, the pad further including an upper metal layer over the interface, the upper metal layer having an upper surface. In some embodiments, the stack structure also includes a passivation layer implemented over the upper metal layer, the passivation layer including a pattern configured to provide a compressive force on the upper metal layer to thereby reduce the likelihood of delamination at the interface, the pattern defining a plurality of openings to expose the upper surface of the upper metal layer.


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