The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2023
Filed:
Feb. 09, 2021
Tecat Technologies (Suzhou) Limited, Suzhou, CN;
Choon Leong Lou, Singapore, SG;
TECAT TECHNOLOGIES (SUZHOU) LIMITED, Suzhou, CN;
Abstract
A semiconductor structure includes a die including a circuitry disposed over a surface of the die or within the die and having specific functions for the die; a heat dissipation member attached to the die by an adhesive disposed between the surface of the die and the heat dissipation member; and a nanostructure disposed between the adhesive and the die, configured to conduct heat from the die to the heat dissipation member, protruding from the adhesive towards the surface of the die and contacting the surface of the die.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile