The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2023

Filed:

Aug. 22, 2022
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Per H. Hammarlund, Sunnyvale, CA (US);

Lior Zimet, Kerem Maharal, IL;

Sergio Kolor, Haifa, IL;

Sagi Lahav, Haifa, IL;

James Vash, San Ramon, CA (US);

Gaurav Garg, Santa Clara, CA (US);

Tal Kuzi, Tel Aviv, IL;

Jeffry E. Gonion, Campbell, CA (US);

Charles E. Tucker, Campbell, CA (US);

Lital Levy-Rubin, Tel Aviv, IL;

Dany Davidov, Tirat Carmel, IL;

Steven Fishwick, St Albans, GB;

Nir Leshem, Beit Yanai, IL;

Mark Pilip, Kiryat Bialik, IL;

Gerard R. Williams, III, Los Altos, CA (US);

Harshavardhan Kaushikkar, Santa Clara, CA (US);

Srinivasa Rangan Sridharan, Santa Clara, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 12/08 (2016.01); G06F 12/0831 (2016.01); G06F 12/128 (2016.01); G06F 12/0811 (2016.01); G06F 12/0815 (2016.01); G06F 12/109 (2016.01); G06F 13/28 (2006.01); G06F 13/16 (2006.01); G06F 13/40 (2006.01); G06F 15/173 (2006.01); G06F 15/78 (2006.01);
U.S. Cl.
CPC ...
G06F 12/0831 (2013.01); G06F 12/0811 (2013.01); G06F 12/0815 (2013.01); G06F 12/109 (2013.01); G06F 12/128 (2013.01); G06F 13/161 (2013.01); G06F 13/1668 (2013.01); G06F 13/28 (2013.01); G06F 13/4068 (2013.01); G06F 15/17368 (2013.01); G06F 15/7807 (2013.01); G06F 2212/305 (2013.01); G06F 2212/657 (2013.01);
Abstract

An integrated circuit (IC) including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture. For example, the IC may include an interconnect fabric configured to provide communication between the one or more memory controller circuits and the processor cores, graphics processing units, and peripheral devices; and an off-chip interconnect coupled to the interconnect fabric and configured to couple the interconnect fabric to a corresponding interconnect fabric on another instance of the integrated circuit, wherein the interconnect fabric and the off-chip interconnect provide an interface that transparently connects the one or more memory controller circuits, the processor cores, graphics processing units, and peripheral devices in either a single instance of the integrated circuit or two or more instances of the integrated circuit.


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