The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2023
Filed:
Jan. 21, 2022
Applicants:
Yoshiki Yamaguchi, Kanagawa, JP;
Ippei Fujimoto, Kanagawa, JP;
Takashi Seto, Kanagawa, JP;
Hiroshi Yoshinaga, Chiba, JP;
Kentaro Yamashita, Shizuoka, JP;
Inventors:
Yoshiki Yamaguchi, Kanagawa, JP;
Ippei Fujimoto, Kanagawa, JP;
Takashi Seto, Kanagawa, JP;
Hiroshi Yoshinaga, Chiba, JP;
Kentaro Yamashita, Shizuoka, JP;
Assignee:
RICOH COMPANY, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03G 15/20 (2006.01);
U.S. Cl.
CPC ...
G03G 15/2053 (2013.01);
Abstract
A nip formation pad includes a base, a high thermal conduction member, and an attachment. The high thermal conduction member has a thermal conductivity greater than a thermal conductivity of the base. The attachment is attached to the high thermal conduction member by elastic deformation of the attachment on the base held between the high thermal conduction member and the attachment.