The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2023

Filed:

Apr. 25, 2022
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Shu-Han Yang, Miao-Li County, TW;

Hui-Min Huang, Miao-Li County, TW;

Chia-Min Yeh, Miao-Li County, TW;

Assignee:

Innolux Corporation, Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1339 (2006.01); G02F 1/1333 (2006.01); G02F 1/1341 (2006.01);
U.S. Cl.
CPC ...
G02F 1/13394 (2013.01); G02F 1/1341 (2013.01); G02F 1/133345 (2013.01);
Abstract

The electronic device includes a first substrate, a second substrate, a first support member, a planarization layer, and an alignment layer. The second substrate is opposite to the first substrate. The first support member is disposed in the peripheral region and located between the first substrate and the second substrate. The planarization layer is disposed on the first substrate and has a first portion and an opening. The first portion is disposed between the opening, and the first support member and the first portion are overlapped in a normal direction of the first substrate. The alignment layer is disposed on the planarization layer. The alignment layer on the first portion has a first thickness. The alignment layer in the opening has a second thickness. The first thickness is greater than or equal to zero and less than the second thickness.


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