Coupling alignment device and method for laser chip and silicon-based optoelectronic chip

Abstract

A coupling alignment device and method for a laser chip and a silicon-based optoelectronic chip are disclosed. The device comprises a transfer mold which includes a substrate, first protrusions, and second protrusions. The first protrusions are provided with through holes and are used for being clamped into first recesses in the laser chip; and the second protrusions are used for being clamped into second recesses in the silicon-based optoelectronic chip. The coupling alignment is achieved by etching the first recesses in the laser chip, etching the second recesses in the silicon-based optoelectronic chip, etching the first protrusions, the second protrusions, and the through holes in the transfer mold. A flip-chip suction nozzle is connected with the transfer mold, which is in alignment with the laser chip, and picks up the laser chip by means of the through holes. Then, the laser chip is assembled on the silicon-based optoelectronic chip by aligning and contacting the transfer mold with the silicon-based optoelectronic chip. The method is of high precision, high efficiency, low costs, and can achieve large-scale and mass production.