The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2023

Filed:

May. 10, 2022
Applicant:

Ipg Photonics Corporation, Oxford, MA (US);

Inventors:

Jordan Kanko, Kingston, CA;

Paul Webster, Kingston, CA;

James M. Fraser, Kingston, CA;

Assignee:

IPG PHOTONICS CORPORATION, Oxford, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/45 (2006.01); G01B 9/02091 (2022.01); B23K 26/03 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B28B 1/00 (2006.01); B28B 17/00 (2006.01); G01B 9/02 (2022.01); B23K 15/00 (2006.01); B29C 64/153 (2017.01); B23K 31/12 (2006.01); B29C 64/268 (2017.01); G01N 21/84 (2006.01); B22F 12/90 (2021.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01); B22F 12/41 (2021.01); B22F 12/44 (2021.01); B22F 12/49 (2021.01); B22F 10/322 (2021.01); B22F 10/36 (2021.01); B22F 10/366 (2021.01); B22F 10/80 (2021.01);
U.S. Cl.
CPC ...
G01N 21/45 (2013.01); B23K 15/0013 (2013.01); B23K 26/032 (2013.01); B23K 31/125 (2013.01); B28B 1/001 (2013.01); B28B 17/0081 (2013.01); B29C 64/153 (2017.08); B29C 64/268 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); G01B 9/02083 (2013.01); G01B 9/02091 (2013.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01); B22F 10/322 (2021.01); B22F 10/36 (2021.01); B22F 10/366 (2021.01); B22F 10/80 (2021.01); B22F 12/41 (2021.01); B22F 12/44 (2021.01); B22F 12/49 (2021.01); B22F 12/90 (2021.01); B22F 2999/00 (2013.01); G01N 2021/8416 (2013.01); Y02P 10/25 (2015.11);
Abstract

Methods and systems are provided for using optical interferometry in the context of material modification processes such as surgical laser, sintering, and welding applications. An imaging optical source that produces imaging light. A feedback controller controls at least one processing parameter of the material modification process based on an interferometry output generated using the imaging light. A method of processing interferograms is provided based on homodyne filtering. A method of generating a record of a material modification process using an interferometry output is provided.


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