The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2023
Filed:
Apr. 24, 2018
Dow Global Technologies Llc, Midland, MI (US);
Rohm and Haas Company, Collegeville, PA (US);
Wenwen Li, Pearland, TX (US);
Joseph J. Zupancic, Glen Ellyn, IL (US);
William J. Harris, Lake Jackson, TX (US);
Paul G. Clark, Midland, MI (US);
Thorsten Schmidt, Richterswil, CH;
Dow Global Technologies LLC, Midland, MI (US);
Rohm and Haas Company, Collegeville, PA (US);
Abstract
Solvent-based adhesive composition are disclosed, the compositions comprising (A) a polyester-urethane resin, (B) an epoxy-terminated polyester compound, (C) a phosphoric acid, and (D) an aliphatic isocyanate curing agent. Methods for preparing a solvent-based adhesive composition, the methods comprising providing a polyester-urethane resin, providing an epoxy-terminated polyester compound, mixing the polyester-urethane resin, epoxy-terminated polyester compound, and phosphoric acid to form a resin mixture, diluting the resin mixture in a solvent to form a diluted resin mixture having an application solid content from 25 to 55 weight percent, based on the total weight of the diluted resin mixture, and curing the diluted resin mixture with an aliphatic isocyanate curing agent at a mix ratio (parts by weight resin mixture before dilution:parts by weight aliphatic isocyanate curing agent) of from 100:1 to 100:12. Laminates prepared comprising the solvent-based adhesives and according to the disclosed methods are also disclosed.