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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11802224 B1

PDFFull Text
Date of Patent:
Oct. 31, 2023

Filed:

Mar. 22, 2022

Adhesive tape, method for fixing electronic device component or on-board device component, and method for producing electronic device or on-board device

Applicant:

Sekisui Chemical Co., Ltd., Osaka, JP;

Inventors:

Aya Adachi, Osaka, JP;

Yudai Ogata, Osaka, JP;

Noriyuki Uchida, Shiga, JP;

Yoshito Arai, Osaka, JP;

Assignee:

SEKISUI CHEMICAL CO., LTD., Osaka, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Daniel H Lee

Int. Cl.
CPC ...
C09J 133/12 (2006.01); C09J 11/08 (2006.01);
U.S. Cl.
CPC ...
C09J 133/12 (2013.01); C09J 11/08 (2013.01); C09J 2203/326 (2013.01); C09J 2301/312 (2020.08); C09J 2301/408 (2020.08); C09J 2301/414 (2020.08);
Abstract

The present invention aims to provide an adhesive tape that is easily peelable while capable of maintaining high adhesion at high temperature. The present invention also aims to provide a method for fixing an electronic device component or an in-vehicle device component using the adhesive tape and a method for producing an electronic device or an in-vehicle device. Provided is an adhesive tape including an adhesive layer containing: an acrylic copolymer; and 0.01 parts by weight or more and 10 parts by weight or less of a compound having a structure represented by the following formula (A) or (B) relative to 100 parts by weight of the acrylic copolymer:

Find Patent Forward Citations

Adachi, Aya. (2023). Adhesive tape, method for fixing electronic device component or on-board device component, and method for producing electronic device or on-board device (U.S. Patent No. 11802224). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11802224

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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