The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2023
Filed:
Jan. 26, 2018
Applicant:
Sekisui Chemical Co., Ltd., Osaka, JP;
Inventors:
Kohei Takeda, Osaka, JP;
Sayaka Wakioka, Osaka, JP;
Yuta Oatari, Osaka, JP;
Takashi Shinjo, Osaka, JP;
Masami Shindo, Osaka, JP;
Assignee:
SEKISUI CHEMICAL CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G 59/40 (2006.01); C08G 73/10 (2006.01); C08L 63/00 (2006.01); C08L 79/08 (2006.01); C09J 163/00 (2006.01); C09J 179/08 (2006.01);
U.S. Cl.
CPC ...
C08G 59/4042 (2013.01); C08G 73/1007 (2013.01); C08G 73/1071 (2013.01); C08G 2170/00 (2013.01);
Abstract
An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.