The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2023
Filed:
Aug. 31, 2021
Applicant:
Fujifilm Business Innovation Corp., Tokyo, JP;
Inventors:
Misaki Suruga, Kanagawa, JP;
Naoto Chiba, Kanagawa, JP;
Yusuke Kabe, Kanagawa, JP;
Seiya Imai, Kanagawa, JP;
Assignee:
FUJIFILM Business Innovation Corp., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 19/06 (2006.01); B65D 19/44 (2006.01); B65D 65/40 (2006.01); B65D 85/68 (2006.01);
U.S. Cl.
CPC ...
B65D 19/06 (2013.01); B65D 19/44 (2013.01); B65D 65/403 (2013.01); B65D 85/68 (2013.01); B65D 2519/00029 (2013.01); B65D 2519/00064 (2013.01); B65D 2519/00159 (2013.01); B65D 2519/00194 (2013.01); B65D 2519/00238 (2013.01); B65D 2519/00273 (2013.01); B65D 2519/00815 (2013.01); B65D 2585/6892 (2013.01);
Abstract
A package unit includes: a base on which a packaged object is placed; a box that surrounds the packaged object; and a lid that covers the box such that a surface provided with an overlapping section where a sheet is folded and overlapped serves as a high impact resistance surface when the packaged object receives an impact.