The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2023

Filed:

Dec. 23, 2019
Applicant:

Université Du Luxembourg, Esch-sur-Alzette, LU;

Inventor:

Edoardo Coperataro, Côte d'Eich, LU;

Assignee:

UNIVERSITÉ DU LUXEMBOURG, Luxembourg, LU;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23Q 17/00 (2006.01); B23Q 17/09 (2006.01); B05B 15/18 (2018.01); B05B 7/14 (2006.01); B24C 1/04 (2006.01); B24C 5/04 (2006.01); H04R 1/40 (2006.01); H04R 29/00 (2006.01);
U.S. Cl.
CPC ...
B23Q 17/0971 (2013.01); B05B 7/1431 (2013.01); B05B 15/18 (2018.02); B23Q 17/098 (2013.01); B24C 1/045 (2013.01); B24C 5/04 (2013.01); H04R 1/406 (2013.01); H04R 29/005 (2013.01); H04R 2201/401 (2013.01); H04R 2201/405 (2013.01);
Abstract

The invention provides a machining system () comprising: a machining apparatus (), notably an abrasive waterjet cutting system (), said machining apparatus being adapted for machining a workpiece (); a monitoring device () adapted for monitoring machining conditions of the machining apparatus () and/or of the workpiece, the monitoring device comprising a plurality of sensors, said plurality of sensors comprising a first sensor () at a first location and a second sensor () at a second location which is distant from the first location. The plurality of sensors comprises a fourth sensor () which is formed by an array of microphones () arranged on a grid. The plurality of sensors comprises accelerometers, strain gauges and microphones. The invention also provides a monitoring method of a machining system () wherein a specific benchmark signature is chosen from a library.


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