The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2023

Filed:

Jun. 05, 2023
Applicants:

Technical Institute of Physics and Chemistry, Cas, Beijing, CN;

Beijing Cas Microneedle Technology Ltd., Beijing, CN;

Inventors:

Yunhua Gao, Beijing, CN;

Zequan Zhou, Beijing, CN;

Suohui Zhang, Beijing, CN;

Guozhong Yang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61M 37/00 (2006.01);
U.S. Cl.
CPC ...
A61M 37/0015 (2013.01); A61M 2037/0023 (2013.01); A61M 2037/0053 (2013.01); A61M 2037/0061 (2013.01);
Abstract

An insoluble transdermal microneedle patch, includes microneedles and a backing. The microneedles include bases and needlepoints located on the base, and materials made for the microneedles include crosslinked sodium alginate. The backing is connected with the bases, and parts of the backing corresponding to the needlepoints are hollow portions. The microneedle patch can act in the skin for a long time, during it is used for transdermal delivery, drugs can enter skin micropores to be absorbed into a body through pores formed after swelled microneedles acting on the skin absorbs water, thereby increasing a bioavailability of the drugs during the transdermal delivery. After drug administration end, the microneedles are completely removed without increasing a metabolic burden in the body, soluble materials are prevented from being accumulated in the body, and the microneedles have good biological safety. A preparation method of the insoluble transdermal microneedle patch and application thereof are provided.


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