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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11800805 B1

PDFFull Text
Date of Patent:
Oct. 24, 2023

Filed:

Oct. 10, 2017

Composite substrate, surface acoustic wave device, and method for manufacturing composite substrate

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Shoji Akiyama, Gunma, JP;

Masayuki Tanno, Gunma, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

GREENBLUM & BERNSTEIN, P.L.C.

Primary Examiner:

Derek J Rosenau

Int. Cl.
CPC ...
H03H 9/02 (2006.01); H10N 30/00 (2023.01); H03H 3/08 (2006.01); H03H 9/25 (2006.01); H10N 30/072 (2023.01); H10N 30/079 (2023.01); H10N 30/086 (2023.01);
U.S. Cl.
CPC ...
H10N 30/10516 (2023.02); H03H 3/08 (2013.01); H03H 9/02559 (2013.01); H03H 9/02834 (2013.01); H03H 9/02897 (2013.01); H03H 9/25 (2013.01); H10N 30/072 (2023.02); H10N 30/079 (2023.02); H10N 30/086 (2023.02);
Abstract

There are provided a method for manufacturing a substrate excellent in heat dissipation with a small loss in radio frequencies with no need of a high temperature process in which a metal impurity is diffused, and a substrate of high thermal conductivity. A composite substrate according to the present invention is a composite substrate having a piezoelectric single crystal substrate, a support substrate, and an intermediate layer provided between the piezoelectric single crystal substrate and the support substrate. The intermediate layer is a film formed of an inorganic material, and at least a part of the film is thermally synthesized silica. The intermediate layer may be separated into at least two layers along the bonding surface of the composite substrate. The first intermediate layer in contact with the support substrate may be a layer including thermally synthesized silica.

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