The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2023
Filed:
Jul. 26, 2021
Semikron Elektronik Gmbh & Co. KG, Nuremberg, DE;
Markus Düsel, Hallerndorf, DE;
Michael Schatz, Nuremberg, DE;
Alexander Wehner, Nuremberg, DE;
Ingo Bogen, Nuremberg, DE;
Jürgen Steger, Hiltpoltstein, DE;
SEMIKRON ELEKTRONIK GMBH & CO. KG, Nuremberg, DE;
Abstract
A production method and a power electronic connecting device for a power semiconductor module, wherein the connecting device is designed as a flexible film stack of a first and a second electrically conductive film and an electrically insulating film arranged therebetween, wherein at least one of the electrically conductive films is structured in itself and thus forms a plurality of film conductor tracks, wherein a first one of these film conductor tracks has, in a first section, a first average thickness and, in a second section, a second average thickness which is at least 10%, preferably at least 20%, smaller than the first average thickness.