The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2023
Filed:
Dec. 01, 2020
Tpk Advanced Solutions Inc., Fujian, CN;
Xian-Bin Xu, Xiamen, CN;
He Luo, Longchang, CN;
Ming-Qiang Fu, Liancheng County, CN;
Xiong-Min Zhang, Zhangpu County, CN;
Chen-Hsin Chang, Taoyuan, TW;
TPK Advanced Solutions Inc., Fujian, CN;
Abstract
A bonding pad structure includes a substrate, a flexible printed circuit board, and a plurality of bonding pins. The bonding pins include at least one central bonding pin and at least two first bonding pins. The at least one central bonding pin is located at a center of bonding pins. The at least two first bonding pins are located farthest away from the at least one central bonding pin and have mirror symmetry with respect to the at least one central bonding pin. The at least one central bonding pin includes a first end and a second end. A first width A of the first end and a second width B of the second end satisfy 0<A/B≤1. A tilt angle θ is formed between one of the at least two first bonding pins and one side of the substrate and satisfies 0<θ≤90.