The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2023

Filed:

Feb. 07, 2020
Applicant:

Hosiden Corporation, Osaka, JP;

Inventors:

Ryo Inoue, Osaka, JP;

Tadashi Hanai, Osaka, JP;

Satoru Fujiwara, Osaka, JP;

Assignee:

HOSIDEN CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 17/00 (2006.01); H01L 41/187 (2006.01); H01L 41/313 (2013.01); H10N 30/073 (2023.01); H10N 30/853 (2023.01);
U.S. Cl.
CPC ...
H04R 17/00 (2013.01); H10N 30/073 (2023.02); H10N 30/853 (2023.02);
Abstract

A sound producing device in which an adhesive layer between a piezoelectric element and a metal plate has sufficient electrical conductivity includes: a metal plate; a piezoelectric ceramic including a first adhesion surface, the first adhesion surface being a surface bonded to the metal plate; an alternating current power supply that applies an alternating voltage to the piezoelectric ceramic; and an adhesive layer formed from conductive adhesive and thermosetting adhesive which are spread over the first adhesion surface, the conductive adhesive being applied in a center portion of the first adhesion surface and the thermosetting adhesive being applied at three or more locations in a periphery of the first adhesion surface. An adhesion surface of the metal plate that is bonded to the piezoelectric ceramic is a second adhesion surface, and the first adhesion surface and the second adhesion surface are bonded together by the adhesive layer.


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