The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2023

Filed:

Jul. 27, 2022
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Kosuke Okawa, Osaka, JP;

Naoki Itabashi, Osaka, JP;

Tomoya Saeki, Osaka, JP;

Hiroshi Hara, Osaka, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01S 5/0237 (2021.01); H01S 5/02315 (2021.01); H05K 3/34 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01S 5/0237 (2021.01); H01S 5/02315 (2021.01); H05K 1/0218 (2013.01); H05K 1/18 (2013.01); H05K 3/34 (2013.01);
Abstract

An optical module includes a circuit board having a through hole for the lead terminal, a signal wiring connected to the lead terminal, a ground layer providing a reference potential, an opening through which the ground layer is exposed, and a bonding material connecting the ground layer to the metallic base. The lead terminal extends in a first direction, and the circuit board and the signal wiring extend in a second direction. When the circuit board is viewed from the first direction, the opening overlaps with the signal wiring, or when the opening does not overlap with the signal wiring, a first distance between the signal wiring and a closest point of the opening to the signal wiring is smaller than a second distance between the closest point and an edge of the circuit board.


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