The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2023
Filed:
Mar. 13, 2020
Nippon Telegraph and Telephone Corporation, Tokyo, JP;
Yuki Yamada, Tokyo, JP;
Fumito Nakajima, Tokyo, JP;
Hideaki Matsuzaki, Tokyo, JP;
Masahiro Nada, Tokyo, JP;
Nippon Telegraph and Telephone Corporation, Tokyo, JP;
Abstract
A substrate, a first n-type contact layer, a buffer layer, a multiplication layer, an electric field control layer, an absorption layer, and a p-type contact layer are provided. An electrically conductive layer is formed in a central portion of the buffer layer. The substrate is made of a semiconductor having thermal conductivity higher than that of InP, such as SiC, and the first n-type contact layer is made of the same semiconductor as that of the substrate but having n-type conductivity. An n electrode is formed over the first n-type contact layer via a second n-type contact layer.