The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2023
Filed:
Jul. 18, 2022
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Kohichi Nakamura, Kawasaki, JP;
Yoshikazu Yamazaki, Sagamihara, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01); H04N 25/75 (2023.01); H04N 25/778 (2023.01);
U.S. Cl.
CPC ...
H01L 27/14634 (2013.01); H01L 23/5225 (2013.01); H01L 24/45 (2013.01); H01L 27/14636 (2013.01); H01L 28/60 (2013.01); H04N 25/75 (2023.01); H04N 25/778 (2023.01);
Abstract
A semiconductor apparatus of the present disclosure includes: a first semiconductor component in which a first circuit unit is provided; and a second semiconductor component in which a second circuit unit is provided and which is stacked to the first semiconductor component, and the second semiconductor component includes a capacitor unit as a decoupling capacitor having a first node and a second node that are connected to the first circuit unit.