The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2023
Filed:
Oct. 06, 2021
Stmicroelectronics Asia Pacific Pte Ltd, Singapore, SG;
Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;
How Yang Lim, Simei, SG;
Olivier Zanellato, Chambery, FR;
STMicroelectronics Asia Pacific Pte Ltd, Singapore, SG;
STMicroelectronics (Grenoble 2) SAS, Grenoble, FR;
Abstract
An integrated circuit package includes a support substrate having a front side and a back side and an optical integrated circuit die having a back side mounted to the front side of the support substrate and having a front side with an optical sensing circuit. A glass optical element die has a back side mounted to the front side of the optical integrated circuit die over the optical sensing circuit. The mounting of the glass optical element die is made by a layer of transparent adhesive which extends to the cover the optical sensing circuit and a portion of the front side of the optical integrated circuit die peripherally surrounding the optical sensing circuit. An encapsulation material body encapsulates the glass optical element die and the optical integrated circuit die.