The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2023
Filed:
May. 14, 2021
Applicant:
Huawei Technologies Co., Ltd., Shenzhen, CN;
Inventors:
Hongquan Sun, Beijing, CN;
Wangsheng Xie, Shenzhen, CN;
Assignee:
Huawei Technologies Co., Ltd., Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 23/528 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01); H01L 27/10 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0248 (2013.01); H01L 23/528 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 27/10 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01);
Abstract
This application discloses an integrated circuit, and relates to the field of electronic technologies, to ensure that the integrated circuit has a relatively high bandwidth and can meet an ESD standard. The integrated circuit includes a die and a transmission line coupled to the die. Electrostatic discharge ESD modules are periodically disposed on the transmission line.