The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2023

Filed:

Jul. 23, 2021
Applicant:

Shanghai Harvest Intelligence Technology Co., Ltd., Shanghai, CN;

Inventor:

Jiandong Huang, Shanghai, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2023.01); G06V 40/13 (2022.01); H10K 50/854 (2023.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); G06V 40/1318 (2022.01); H10K 50/854 (2023.02);
Abstract

The present disclosure provides a module structure and an electronic apparatus. The module structure includes: a sensing component, a sensing surface and a display component disposed between the sensing component and the sensing surface; an air layer disposed between the display component and the sensing component; and a scattering layer disposed between the air layer and the display component; wherein light generated by the display component is reflected or refracted on the sensing surface to form signal light carrying an information, and the signal light is transmitted through the scattering layer and the air layer and received by the sensing component. The present disclosure can realize decoupling between the sensing component and the display component, reduce the influence of a bonding stress on a display effect of the display component, and avoid the influence of the air layer on the realization of the function of the sensing component.


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