The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2023

Filed:

Dec. 16, 2020
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Taeyoung Park, Asan-si, KR;

Jungseon Park, Cheonan-si, KR;

Jun-Hee Lee, Seoul, KR;

Hyunwoo Lee, Seongnam-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Yongin-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 41/00 (2006.01); H01L 23/00 (2006.01); H05K 3/32 (2006.01); H10K 59/131 (2023.01);
U.S. Cl.
CPC ...
H01L 24/80 (2013.01); H01L 24/74 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H05K 3/323 (2013.01); H05K 3/328 (2013.01); H01L 2224/75701 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/75754 (2013.01); H01L 2224/75804 (2013.01); H01L 2224/8013 (2013.01); H01L 2224/80132 (2013.01); H01L 2224/80205 (2013.01); H01L 2224/8313 (2013.01); H01L 2224/83132 (2013.01); H05K 2203/0285 (2013.01); H05K 2203/1509 (2013.01); H05K 2203/166 (2013.01); H05K 2203/167 (2013.01); H10K 59/131 (2023.02);
Abstract

A method of fabricating a display device may include disposing a display panel on a stage to be parallel to an XZ-plane defined by a horizontal X-axis and a vertical Z-axis, measuring a height of a first side surface of the display panel in a direction of the Z-axis, rotating the stage such that the first side surface is parallel to a reference horizontal line in case that a result of the measured height indicates that the first side surface includes an inclined surface, moving the display panel in a direction of the Z-axis such that a first pad disposed on the first side surface overlaps the reference horizontal line, and bonding a second pad of a printed circuit board with the first pad.


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