The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2023
Filed:
Nov. 29, 2021
Infineon Technologies Ag, Neubiberg, DE;
Walter Hartner, Bad Abbach-Peissing, DE;
Francesca Arcioni, Munich, DE;
Tuncay Erdoel, Unterhaching, DE;
Vincenzo Fiore, Linz, AT;
Helmut Kollmann, Linz, AT;
Arif Roni, Neubiberg, DE;
Emanuele Stavagna, Linz, AT;
Christoph Wagner, Enns, AT;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor device includes a semiconductor chip including an electrical contact arranged on a main surface of the semiconductor chip, an external connection element configured to provide a first electrical connection between the semiconductor device and a printed circuit board, and an electrical redistribution layer extending in a direction parallel to the main surface of the semiconductor chip and configured to provide a second electrical connection between the electrical contact of the semiconductor chip and the external connection element. The electrical redistribution layer includes a ground line connected to a ground potential and a signal line configured to carry an electrical signal having a wavelength.