The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2023
Filed:
May. 17, 2021
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Akio Igarashi, Nagaokakyo, JP;
Kentaro Yamaguchi, Nagaokakyo, JP;
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Abstract
A method for manufacturing a coil component includes preparing a wire; preparing a terminal electrode formed from a metal plate having a flat surface to which an end portion of the wire is to be connected, a low surface that is lower in a thickness direction of the terminal electrode than the flat surface, and a shift surface that connects the flat surface to the low surface and that increases a height in the thickness direction from the low surface to the flat surface; placing the end portion of the wire on the flat surface such that the wire is provided sequentially along the flat surface, the shift surface, and the low surface in this order from the end portion thereof; and thermally pressure-bonding the end portion of the wire to the flat surface such that the heated chip is pressed so that an edge thereof overlaps the low surface.