The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2023
Filed:
Dec. 23, 2020
Applicant:
Proterial, Ltd., Tokyo, JP;
Inventors:
Yuichi Ogawa, Tokyo, JP;
Naoki Itoh, Tokyo, JP;
Takahiro Shiratake, Tokyo, JP;
Motoki Ohta, Tokyo, JP;
Assignee:
PROTERIAL, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 1/147 (2006.01); B22D 11/049 (2006.01); C21D 6/00 (2006.01); C21D 9/52 (2006.01); C22C 38/02 (2006.01); C22C 38/08 (2006.01); C22C 38/10 (2006.01); C22C 38/12 (2006.01); C22C 38/16 (2006.01); H01F 41/02 (2006.01); H01F 27/25 (2006.01);
U.S. Cl.
CPC ...
H01F 1/14766 (2013.01); B22D 11/049 (2013.01); C21D 6/001 (2013.01); C21D 6/005 (2013.01); C21D 6/007 (2013.01); C21D 6/008 (2013.01); C21D 9/52 (2013.01); C22C 38/02 (2013.01); C22C 38/08 (2013.01); C22C 38/10 (2013.01); C22C 38/12 (2013.01); C22C 38/16 (2013.01); H01F 41/02 (2013.01); H01F 27/25 (2013.01);
Abstract
The soft magnetic alloy of the present disclosure is represented by a composition formula of FeSiBCuMwhere M is at least one type of element selected from a group consisting of Nb, Mo, V, Zr, Hf, and W, and the formula satisfies 82.5≤a≤86, 0.3≤b≤3, 12.5≤c≤15.0, 0.05≤d≤0.9, and 0≤e<0.4 in at %. The soft magnetic alloy includes a structure that has a crystal grain with a grain diameter of 60 nm or less in an amorphous phase.