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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11796915 B1

PDFFull Text
Date of Patent:
Oct. 24, 2023

Filed:

Mar. 09, 2021

Compound, polymer, pattern forming material, pattern forming method, and method of manufacturing semiconductor device

Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Norikatsu Sasao, Kawasaki Kanagawa, JP;

Koji Asakawa, Kawasaki Kanagawa, JP;

Shinobu Sugimura, Yokohama Kanagawa, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:

Finnegan, Henderson, Farabow, Garrett & Dunner, LLP

Primary Examiner:

Mark F Huff

Assistant Examiner:

Alexander Nicholas Lee

Int. Cl.
CPC ...
G03F 7/11 (2006.01); C07C 69/78 (2006.01); C08F 12/22 (2006.01); H01L 21/311 (2006.01); H01L 21/027 (2006.01); H10B 41/27 (2023.01); H10B 43/27 (2023.01);
U.S. Cl.
CPC ...
G03F 7/11 (2013.01); C07C 69/78 (2013.01); C08F 12/22 (2013.01); H01L 21/0271 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H10B 41/27 (2023.02); H10B 43/27 (2023.02);
Abstract

A pattern forming material used for forming an organic film on a film to be processed of a substrate having the film to be processed, the organic film being patterned and then impregnated with a metallic compound to form a composite film which is used as a mask pattern when processing the film to be processed, the pattern forming material contains a polymer including a monomer unit represented by the following general formula (3),

Find Patent Forward Citations

Sasao, Norikatsu. (2023). Compound, polymer, pattern forming material, pattern forming method, and method of manufacturing semiconductor device (U.S. Patent No. 11796915). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11796915

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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