The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2023
Filed:
Mar. 25, 2021
Toto Ltd., Fukuoka, JP;
TOTO LTD., Fukuoka, JP;
Abstract
Provided is a faucet fixture to which antifouling functionality is imparted without causing localized corrosion. The present invention is a faucet fixture comprising a metal base material and a plating layer partially formed on the surface of the metal base material. The metal base material contains at least one metal element species selected from the group consisting of copper, zinc, and tin. The plating layer contains at least one metal element species selected from the group consisting of chromium and nickel. An organic layer is further provided on the plating layer, with a passive layer present on the surface of the plating layer being interposed therebetween. The organic layer is bonded to the passive layer via the bonding of a metal element (M), which constitutes the passive layer, and a phosphorus atom (P) in at least one type of group (X) selected from the group consisting of phosphonate groups, phosphate groups, and phosphinate groups, with an oxygen atom (O) interposed therebetween (M-O—P bond). Group X is bonded to a group R (wherein R is a hydrocarbon group, or a group comprising an atom other than carbon at one or two locations within a hydrocarbon group). The phosphorus atom concentration in the portion of the surface of the metal base material on which the plating layer is not formed is lower than the phosphorus atom concentration in the organic layer provided on the plating layer.