The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2023

Filed:

Aug. 09, 2022
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Chia-Cheng Hsu, Hsinchu County, TW;

Hsu-Shen Chu, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); C22C 28/00 (2006.01); C22C 30/04 (2006.01);
U.S. Cl.
CPC ...
C22C 28/00 (2013.01); B32B 15/01 (2013.01); C22C 30/04 (2013.01); B32B 2307/302 (2013.01); B32B 2307/732 (2013.01);
Abstract

A low-melting-point alloy composite material and a composite material structure are provided. The low-melting-point alloy composite material includes 48 to 54 wt. % In, 30 to 36 wt. % Bi, 14 to 21 wt. % Sn, and at least one selected from 0.1 to 0.3 wt. % carbon material and 0.05 to 0.1 wt. % boron nitride (BN). The composite material structure includes a metal layer, a low-melting-point alloy composite material layer, and an interface material layer, wherein the material of the low-melting-point alloy composite material layer is the above low-melting-point alloy composite material, and the interface material layer is formed between the metal layer and the low-melting-point alloy composite material layers.


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