The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2023
Filed:
Aug. 14, 2018
Applicant:
Resonac Corporation, Tokyo, JP;
Inventors:
Kazutaka Honda, Tokyo, JP;
Keiko Ueno, Tokyo, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 179/08 (2006.01); C09J 7/35 (2018.01); C09J 7/38 (2018.01); C09J 7/10 (2018.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
C09J 179/08 (2013.01); C09J 7/10 (2018.01); C09J 7/35 (2018.01); C09J 7/385 (2018.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01);
Abstract
An adhesive composition contains a resin component, a thermal crosslinking agent, and a curing agent, in which the resin component contains a resin having a maleimide group. In a method for producing a semiconductor device having a plurality of connection units for connecting a semiconductor chip and a wiring circuit substrate to each other, or for connecting a plurality of semiconductor chips to each other, a first connection unit is electrically connected to a second connection unit, and at least a portion of the first and second connection units is sealed using the adhesive composition.