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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11795335 B1

PDFFull Text
Date of Patent:
Oct. 24, 2023

Filed:

Mar. 22, 2022

Resin composition for modeling material, light curing molding ink set, and method for manufacturing optically shaped article

Applicants:

Maxell, Ltd., Kyoto, JP;

Mimaki Engineering Co., Ltd., Nagano, JP;

Inventors:

Katsuyuki Kitou, Kyoto, JP;

Taeko Izumo, Kyoto, JP;

Masakatsu Okawa, Nagano, JP;

Kenta Hongo, Nagano, JP;

Assignees:

MAXELL, LTD., Kyoto, JP;

MIMAKI ENGINEERING CO., LTD., Nagano, JP;

Attorney:

JCIPRNET

Primary Examiner:

Jessica Whiteley

Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08F 2/50 (2006.01); C08G 61/04 (2006.01); C09D 11/101 (2014.01); B33Y 70/00 (2020.01); B33Y 10/00 (2015.01); C08F 2/44 (2006.01); C08F 290/06 (2006.01); C08F 283/06 (2006.01); C08F 220/30 (2006.01); B29C 64/112 (2017.01); C09D 11/107 (2014.01); C09D 11/322 (2014.01); C09D 11/38 (2014.01); B29C 64/40 (2017.01); C08F 222/10 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
C09D 11/101 (2013.01); B29C 64/112 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C08F 2/44 (2013.01); C08F 2/50 (2013.01); C08F 220/301 (2020.02); C08F 283/06 (2013.01); C08F 290/067 (2013.01); C09D 11/107 (2013.01); C09D 11/322 (2013.01); C09D 11/38 (2013.01); B29C 64/40 (2017.08); B29K 2105/0005 (2013.01); C08F 222/102 (2020.02); C08F 222/1025 (2020.02);
Abstract

There is provided a resin composition for a modeling material, used for shaping a modeling material by a manufacturing method for light curing molding using an ink-jet scheme, comprising (A) an ethylenic unsaturated monomer as a photocuring component, (B) a photopolymerization initiator, and (C) a surface adjusting agent, wherein the resin composition for a modeling material has surface tension Mt of 26.0 to 33.0 mN/m, and the resin composition for a modeling material has surface tension Mst represented by the following (i) expression of 33.0 mN/m or more, and this resin composition for a modeling materialcan afford a light cured article having the good dimensional accuracy.

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