The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2023
Filed:
May. 28, 2020
Applicant:
Denso Corporation, Kariya, JP;
Inventors:
Assignee:
DENSO CORPORATION, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 75/06 (2006.01); C09J 7/10 (2018.01); C08G 18/62 (2006.01); C08G 18/73 (2006.01); C08G 18/76 (2006.01); C09J 175/04 (2006.01);
U.S. Cl.
CPC ...
C08L 75/06 (2013.01); C08G 18/6204 (2013.01); C08G 18/6229 (2013.01); C08G 18/73 (2013.01); C08G 18/76 (2013.01); C09J 7/10 (2018.01); C09J 175/04 (2013.01); C08L 2203/16 (2013.01);
Abstract
A curable resin composition comprises a (meth)acrylic polyol, a hydrogenated polyolefin-based polyol, and a polyisocyanate. The (meth)acrylic polyol includes a polymer having a hydroxyl value of 5 mg KOH/g or more and 150 mg KOH/g or less, a glass transition temperature of −70° C. or more and −40° C. or less, and a number average molecular weight of 500 or more and 20000 or less, and which is liquid at 25° C. The hydrogenated polyolefin-based polyol has an iodine value of 15 or less. An electrical component () comprises a sealing member () including a cured product of the curable resin composition.