The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2023

Filed:

Jun. 26, 2020
Applicant:

GM Cruise Holdings, Llc, San Francisco, CA (US);

Inventors:

Brendan Hermalyn, San Francisco, CA (US);

Radu Raduta, San Francisco, CA (US);

Devin Cass, San Francisco, CA (US);

Assignee:

GM Cruise Holdings LLC, San Francisco, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60W 60/00 (2020.01); G01S 17/931 (2020.01); G01S 15/931 (2020.01); G01S 7/481 (2006.01); G01S 7/497 (2006.01); G01S 7/40 (2006.01); B60W 50/04 (2006.01); G01S 7/02 (2006.01);
U.S. Cl.
CPC ...
B60W 60/0025 (2020.02); B60W 50/04 (2013.01); G01S 7/02 (2013.01); G01S 7/40 (2013.01); G01S 7/4813 (2013.01); G01S 7/497 (2013.01); G01S 15/931 (2013.01); G01S 17/931 (2020.01); B60W 2420/42 (2013.01); B60W 2420/52 (2013.01);
Abstract

The subject disclosure relates to features for improving the modularity and interoperability of sensors and in particular, sensors deployed for use in vehicle related sensing applications. In some aspects, the disclosed technology encompasses a sensor aggregation module (e.g., sensor pod) that includes a sensor enclosure having an interior volume configured for housing one or more sensors, a data port integrated into an exterior surface of the sensor enclosure, wherein the data port is configured to be electrically coupled to a vehicle data port, and a plurality of sensor ports disposed within an interior volume of the sensor enclosure, wherein the sensor ports are configured for modular connectivity to the one or more sensors.


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