The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2023

Filed:

Mar. 09, 2020
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Yusuke Yamanaka, Nagoya, JP;

Takafumi Hashimoto, Nagoya, JP;

Tetsuya Motohashi, Nagoya, JP;

Yasukazu Ono, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/12 (2006.01); B29B 15/10 (2006.01); B29C 70/42 (2006.01); C08J 5/04 (2006.01); B29K 101/10 (2006.01); B29K 105/12 (2006.01); B29K 307/04 (2006.01);
U.S. Cl.
CPC ...
B29C 70/12 (2013.01); B29B 15/105 (2013.01); B29C 70/42 (2013.01); C08J 5/042 (2013.01); B29K 2101/10 (2013.01); B29K 2105/12 (2013.01); B29K 2307/04 (2013.01);
Abstract

A fiber-reinforced resin molding material molded product includes a fiber-reinforced resin molding material prepared by impregnating chopped fiber bundles obtained by cutting a reinforcing fiber bundle with a matrix resin, wherein in a region excluding 30 mm from an edge of the molded product, when an arbitrary rectangular region having an area of 40 mmor more and defined by a thickness of the molded product and a width in a direction perpendicular to a thickness direction of the molded product is set in a cross section in an arbitrary thickness direction of the molded product, with respect to a bundle thickness of the chopped fiber bundles present in the set rectangular region.


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