The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2023
Filed:
Dec. 16, 2021
Seiko Epson Corporation, Tokyo, JP;
Mitsutoshi Kato, Ota, JP;
Seiichiro Yamashita, Yokohama, JP;
Shohei Onodera, Akumi, JP;
Juri Yamaguchi, Matsumoto, JP;
Kana Horiuchi, Kamiina, JP;
Abstract
An injection molding apparatus includes: a first upstream mold formed with a first gate opening into which a first molding material flows; a second upstream mold formed with a second gate opening into which a second molding material flows; a first injection unit configured to inject the first molding material; a second injection unit configured to inject the second molding material; and a downstream mold configured to be clamped to each of the first upstream mold and the second upstream mold. The first injection unit includes a plasticizing mechanism that plasticizes at least a part of a thermoplastic material containing a thermoplastic resin to generate the first molding material. The second injection unit includes a mechanism that mixes a resin and a curing agent to generate the second molding material that is a thermosetting mixture.