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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11794388 B1

PDFFull Text
Date of Patent:
Oct. 24, 2023

Filed:

Jun. 02, 2022

Dual area bi-injection molding

Applicant:

Dell Products L.p., Round Rock, TX (US);

Inventors:

Yonghong Duan, Shanghai, CN;

David William Grunow, Round Rock, TX (US);

David Wheeler Williams, Salado, TX (US);

Patrick A. Hampton, Round Rock, TX (US);

Anthony Wayne Howard, Austin, TX (US);

Assignee:

Dell Products L.P., Round Rock, TX (US);

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Mohammad M Ameen

Int. Cl.
CPC ...
B29C 45/13 (2006.01); B29C 45/00 (2006.01); B29C 45/14 (2006.01); B29C 45/22 (2006.01); B29K 307/04 (2006.01); B29L 31/34 (2006.01); B29K 309/08 (2006.01);
U.S. Cl.
CPC ...
B29C 45/13 (2013.01); B29C 45/0001 (2013.01); B29C 45/14 (2013.01); B29C 45/22 (2013.01); B29K 2307/04 (2013.01); B29K 2309/08 (2013.01); B29K 2995/0005 (2013.01); B29L 2031/3481 (2013.01);
Abstract

Forming a casing of an information handling system using dual area bi-injection, the method including injecting a first material into a mold: i) at first locations of the mold to form a first portion of a casing, and ii) at second locations of the mold to form a second portion of the casing; and injecting a second material into the mold at third locations of the mold to form a third portion of the casing; wherein injection of the first material and the second material into the mold is done concurrently, wherein injection of the first and the second material into the mold forms a first bonding interface and a second bonding interface between the first material and the second material such that the second material is excluded from ingression to the first portion and the second portion of the casing.

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Duan, Yonghong. (2023). Dual area bi-injection molding (U.S. Patent No. 11794388). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11794388

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