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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11794387 B1

PDFFull Text
Date of Patent:
Oct. 24, 2023

Filed:

Jul. 29, 2022

Injection molding apparatus

Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Seiichiro Yamashita, Yokohama, JP;

Mitsutoshi Kato, Ota, JP;

Assignee:

SEIKO EPSON CORPORATION;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Thu-Khanh T Nguyen

Int. Cl.
CPC ...
B29C 45/18 (2006.01); B29C 45/04 (2006.01); B29C 45/22 (2006.01); B29C 45/26 (2006.01); B29C 45/47 (2006.01); B29C 45/73 (2006.01); B29C 45/17 (2006.01);
U.S. Cl.
CPC ...
B29C 45/0441 (2013.01); B29C 45/1756 (2013.01); B29C 45/2602 (2013.01); B29C 45/2681 (2013.01); B29C 45/47 (2013.01); B29C 45/7312 (2013.01);
Abstract

An injection molding apparatus includes: a first fixed mold attachment and detachment unit configured to attach and detach a first fixed mold; a second fixed mold attachment and detachment unit configured to attach and detach a second fixed mold; a first movable mold attachment and detachment unit configured to attach and detach a first movable mold; a first injection unit configured to inject a first molding material through a first gate opening of the first fixed mold; a second injection unit configured to inject a second molding material through a second gate opening of the second fixed mold; and a position changing unit configured to change a position of the first movable mold attachment and detachment unit such that the first movable mold is located at a position facing the first fixed mold or the second fixed mold. The position changing unit includes: a driving unit, a rotation shaft member configured to rotate by the driving unit, and a rotation disk coupled to the rotation shaft member and provided with the first movable mold attachment and detachment unit. The rotation disk is configured to rotate about a rotation axis of the rotation shaft member, and a flow path that communicates with the first movable mold and through which a medium flows is formed in the rotation shaft member.

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