The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2023
Filed:
Feb. 01, 2017
Applicant:
Firmenich SA, Geneva, CH;
Inventors:
Assignee:
Firmenich SA, Satigny, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A23L 27/20 (2016.01); A23L 27/00 (2016.01); A23L 27/21 (2016.01); A23L 27/23 (2016.01); A23L 27/26 (2016.01); A21D 2/24 (2006.01); A23K 20/142 (2016.01); A23D 7/005 (2006.01); A23L 27/22 (2016.01); A23K 20/111 (2016.01); A23L 27/24 (2016.01); A23K 20/147 (2016.01); A21D 2/36 (2006.01); A23K 40/10 (2016.01); A23K 50/40 (2016.01); A23K 20/153 (2016.01); C07C 233/11 (2006.01); C07C 235/34 (2006.01); A23L 2/39 (2006.01); A23L 3/44 (2006.01); A23D 9/007 (2006.01);
U.S. Cl.
CPC ...
A23L 27/204 (2016.08); A21D 2/24 (2013.01); A21D 2/36 (2013.01); A23D 7/0053 (2013.01); A23D 7/0056 (2013.01); A23K 20/111 (2016.05); A23K 20/142 (2016.05); A23K 20/147 (2016.05); A23K 20/153 (2016.05); A23K 40/10 (2016.05); A23K 50/40 (2016.05); A23L 27/21 (2016.08); A23L 27/22 (2016.08); A23L 27/23 (2016.08); A23L 27/235 (2016.08); A23L 27/24 (2016.08); A23L 27/26 (2016.08); A23L 27/70 (2016.08); A23L 27/74 (2016.08); A23L 27/88 (2016.08); C07C 233/11 (2013.01); C07C 235/34 (2013.01); A23D 7/005 (2013.01); A23D 9/007 (2013.01); A23L 2/39 (2013.01); A23L 3/44 (2013.01); A23V 2002/00 (2013.01); A23V 2200/15 (2013.01); A23V 2200/16 (2013.01); A23V 2200/238 (2013.01); A23V 2250/0622 (2013.01); A23V 2250/302 (2013.01); A23V 2300/10 (2013.01); A23V 2300/31 (2013.01);
Abstract
Provided herein is a process for increasing the dissolution rate of a sparingly water soluble flavor or taste modifying compound in water comprising: