The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

Jun. 02, 2021
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Chikao Ikenaga, Tokyo, JP;

Isao Inoue, Tokyo, JP;

Yoko Nakamura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 50/822 (2023.01); H10K 50/813 (2023.01); H10K 50/844 (2023.01); H10K 71/00 (2023.01);
U.S. Cl.
CPC ...
H10K 50/822 (2023.02); H10K 50/813 (2023.02); H10K 50/844 (2023.02); H10K 71/00 (2023.02);
Abstract

A manufacturing method for an electronic device includes a preparation step of preparing a layered body including a substrate, two or more first electrodes, and organic layers, the substrate having a first surface and a second surface that is positioned opposite to the first surface, the two or more first electrodes positioned above the first surface of the substrate, the organic layers positioned above the first electrodes; a second electrode formation step of forming a second electrode above the organic layers so that the second electrode overlaps the two or more first electrodes when viewed in a normal direction to the first surface of the substrate; and a removal step of partly removing regions of the second electrode that is positioned between the first electrodes in plan view.


Find Patent Forward Citations

Loading…