The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

May. 24, 2019
Applicants:

Chongqing Advance Display Technology Research, Chongqing, CN;

Chongqing Hkc Optoelectronics Technology Co., Ltd, Chongqing, CN;

Inventor:

Xiaoyu Huang, Chongqing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); G02F 1/1362 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); G02F 1/136286 (2013.01); H05K 2201/0738 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/10136 (2013.01); H05K 2201/10174 (2013.01);
Abstract

This application relates to a printed circuit board, including: a plurality of bonding pad areas configured to be electrically connected to a display; a plurality of dummy pad areas located in the plurality of bonding pad areas and configured to be connected to the ground; and a contact pad area existing between the plurality of dummy pad areas and electrically connected to the bonding pad area. The contact pad area includes a plurality of contact pads configured to be electrically connected to an external input connector. A width of the plurality of contact pads is 0.3 mm, and a distance between the plurality of contact pads is 0.2 mm. A length of the contact pad is the same as a length of a bonding pad in the bonding pad area.


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